Can E Korman

Title: Can E Korman: Innovator in Flexible IC/Microfluidic Integration

Introduction

Can E Korman is a notable inventor based in McLean, Virginia. He has made significant contributions to the field of flexible integrated circuits and microfluidic systems. His innovative approach has led to the development of a unique hybrid integration method that enhances the functionality of electronic devices.

Latest Patents

Korman holds a patent for a groundbreaking invention titled "Flexible IC/Microfluidic Integration and Packaging." This patent describes a method and resulting device that utilizes a single flexible elastomer substrate, such as polydimethylsiloxane (PDMS). The invention features dedicated microchannels filled with liquid metals or low melting point solders, which provide electrical interconnects to a solid-state IC die, such as CMOS. Additionally, it includes microchannels for hybrid integration with microfluidics without requiring any post-processing on the IC die. The liquid metal used in this innovative design can be a gallium-indium-tin eutectic alloy, commonly known as Galinstan.

Career Highlights

Korman's career is marked by his dedication to advancing technology in the field of microelectronics and fluidics. His work has not only contributed to academic research but has also paved the way for practical applications in various industries.

Collaborations

Throughout his career, Korman has collaborated with esteemed colleagues, including Zhenyu Li and Mona Zaghloul. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Can E Korman's contributions to flexible IC and microfluidic integration exemplify the spirit of innovation in modern technology. His patented methods and collaborative efforts continue to influence the field, showcasing the potential for future advancements.