C Kumar Patel

Title: C Kumar Patel: Innovator in Integrated Circuit Packaging

Introduction

C Kumar Patel is a notable inventor based in Summit, NJ (US). He has made significant contributions to the field of integrated circuit packaging. His innovative approach addresses critical challenges faced in the industry.

Latest Patents

C Kumar Patel holds a patent for an "Integrated circuit package with strain relief grooves." This invention addresses the issue of bowing in IC packages due to differential contractions as their size and thickness decrease. The solution involves molding strain relief grooves into the surface of the plastic package, effectively mitigating the problem.

Career Highlights

Patel has had a distinguished career at AT&T Bell Laboratories, where he has contributed to various advancements in technology. His work has been instrumental in enhancing the reliability and performance of integrated circuits.

Collaborations

One of his notable collaborators is Louis Thomas Manzione, with whom he has worked on various projects at AT&T Bell Laboratories.

Conclusion

C Kumar Patel's innovative contributions to integrated circuit packaging demonstrate his expertise and commitment to advancing technology. His patent reflects a practical solution to a pressing issue in the industry.