Company Filing History:
Years Active: 2018-2024
Title: Innovations of Byungmoon Bae in Semiconductor Technology
Introduction
Byungmoon Bae is a prominent inventor based in Daegu, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of six patents. His work focuses on enhancing the efficiency and effectiveness of semiconductor substrates and devices.
Latest Patents
One of his latest patents is related to a semiconductor substrate and method of sawing the same. This innovation includes a plurality of semiconductor chips and a protection pattern. The semiconductor chips are divided by two intersecting scribe lanes, with corners of the chips positioned at their intersection. The protection pattern surrounds these corners to prevent damage during subsequent grinding processes. Another notable patent involves a substrate dicing method and the fabrication of semiconductor devices. This method utilizes a laser beam to form reformed patterns in a substrate, followed by grinding to thin the substrate and dividing it into multiple semiconductor chips.
Career Highlights
Byungmoon Bae is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the field.
Collaborations
He collaborates with talented coworkers, including Junho Yoon and Junggeun Shin, who share his passion for innovation in semiconductor technology.
Conclusion
Byungmoon Bae's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the industry. His inventions continue to shape the future of semiconductor applications.