Byung Kwan Ko

Title: Byung Kwan Ko - Innovator in Pouch Molding Technology

Introduction

Byung Kwan Ko is an accomplished inventor based in Daejeon, South Korea. He is currently associated with LG Energy Solution, Ltd. Despite having no granted patents to his name, he has made significant contributions to the field of pouch molding technology through his innovative patent applications.

Latest Patent Applications

Byung Kwan Ko has filed several notable patent applications, including:

1. **Pouch Molding Apparatus** - This apparatus includes a die plate, a first stripper, a punch part, and a second stripper. The die plate has a flat plate shape, allowing a pouch film to be seated on its upper portion. It features a molding hole that passes through the top and bottom surfaces of the die plate. The first stripper presses and fixes the pouch film to the upper side of the die plate and has a punch hole corresponding to the molding hole. The punch part is drawn in and out of the punch hole of the first stripper and the molding hole of the die plate to mold the pouch film. The second stripper protrudes from the bottom surface of the first stripper to press and fix the pouch film.

2. **Pouch Shaping Apparatus Capable of Remedying Pouch Wrinkles** - This apparatus includes a support unit that allows a laminate sheet to be disposed on its upper surface. A movable stripper presses and fixes the outer periphery of the laminate sheet when moved downwards. A punch, also movable, forms an electrode assembly receiving portion in the laminate sheet while being inserted into a shaping portion located at the center of the support unit. The support unit consists of an upper support and a support plate, with a core member located between them, having a predetermined thickness.

Conclusion

Byung Kwan Ko's innovative work in pouch molding technology showcases his dedication to advancing the field. His latest patent applications reflect his commitment to solving practical challenges in the industry.