Byung Ho Kwon

Title: Byung Ho Kwon - Innovator in Wafer Polishing Technology

Introduction

Byung Ho Kwon is a notable inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of wafer polishing technology. His innovative approach has led to the development of advanced devices that enhance the efficiency and effectiveness of wafer processing.

Latest Patents

Byung Ho Kwon holds a patent for a chemical-mechanical wafer polishing device. This device features an elastic membrane that includes a circular action plate portion and a membrane circumferential wall portion. The design incorporates a chamber formed between these components, which is crucial for the polishing process. The membrane also contains a cooling channel portion and a supply penetration section that facilitates the flow of cooling fluid, ensuring optimal performance during wafer polishing.

Career Highlights

Kwon is currently employed at TSC Corporation, where he continues to innovate and develop new technologies in the semiconductor industry. His work has been instrumental in advancing the capabilities of wafer polishing devices, making them more efficient and reliable.

Collaborations

Kwon collaborates with his coworker, Oh Su Kim, to further enhance their research and development efforts. Together, they aim to push the boundaries of technology in the semiconductor field.

Conclusion

Byung Ho Kwon's contributions to wafer polishing technology exemplify his dedication to innovation in the semiconductor industry. His patent and ongoing work at TSC Corporation highlight his role as a key figure in advancing manufacturing processes.