Byung Duk Na

Title: Byung Duk Na: Innovator in Printed Circuit Board Technology

Introduction

Byung Duk Na is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of electronics, particularly in the development of printed circuit boards. His innovative work has led to the creation of a patented technology that enhances the functionality and efficiency of electronic components.

Latest Patents

Byung Duk Na holds a patent for a printed circuit board and an electronic component-embedded substrate. This invention includes a first insulating layer, a second insulating layer, and a barrier layer positioned between them. The design features a cavity that penetrates through one of the insulating layers and a first wiring layer that is in contact with the barrier layer. Notably, the barrier layer has a modulus that is lower than that of the insulating layers, which contributes to the overall performance of the circuit board.

Career Highlights

Byung Duk Na is currently employed at Samsung Electro-Mechanics Co., Ltd., a leading company in the electronics industry. His role involves research and development, where he applies his expertise to advance technology in printed circuit boards and related components.

Collaborations

Some of his coworkers include Mi Sun Hwang and Jun Hyeong Jang, who collaborate with him on various projects within the company.

Conclusion

Byung Duk Na's contributions to printed circuit board technology exemplify his innovative spirit and dedication to advancing electronic components. His patent reflects a significant step forward in the field, showcasing the importance of research and development in technology.