Byong-gook Jeong

Title: **Byong-gook Jeong: Innovator in Semiconductor Fabrication**

Introduction

Byong-gook Jeong is a notable inventor based in Anyang-si, South Korea, who has made significant contributions in the field of semiconductor technology. With a keen focus on innovation, he has been instrumental in advancing methods related to semiconductor die separation and packaging.

Latest Patents

Byong-gook Jeong holds a patent titled "Method of Singulating Semiconductor Die and Method of Fabricating Semiconductor Package." This innovative method outlines a process involving a substrate that accommodates semiconductor dies, complete with a modified layer along partition lanes. It elaborates on the sequential application of adhesive and base films, ultimately leading to the effective separation of semiconductor dies through lateral force and subsequent gas pressure application, followed by ultraviolet irradiation.

Career Highlights

Jeong is currently associated with Samsung Electronics Co., Ltd., a pioneering company in the electronics sector. His work has significantly contributed to enhancing the efficiency and accuracy in the fabrication of semiconductor packages. His expertise in semiconductor technologies sets a benchmark for quality and innovation in the industry.

Collaborations

During his career, Byong-gook Jeong has collaborated with fellow innovators such as Byung-ho Kim and Youn-jo Mun. These partnerships exemplify a cooperative approach toward technological advancement, encouraging a culture of sharing insights and fostering innovation within the semiconductor industry.

Conclusion

Byong-gook Jeong's innovative approach to semiconductor die separation and packaging not only showcases his engineering prowess but also contributes to the ongoing evolution of semiconductor technology. His commitment to improving manufacturing processes ensures that he remains a key figure in the realm of innovation at Samsung Electronics and beyond.