Company Filing History:
Years Active: 2018
Title: Bunsuke Ogawa: Innovator in Lead Solder Joint Technology
Introduction
Bunsuke Ogawa is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of solder joint technology, particularly in enhancing the durability of lead solder joints. His innovative approach addresses critical issues related to joint strength under heat cycles.
Latest Patents
Ogawa holds a patent for a lead solder joint structure and its manufacturing method. This invention focuses on restraining the degradation of joint strength even when subjected to heat cycles. The patented structure includes a first member joined to a second member using lead solder. It comprises a first solder layer that serves as a core for the first member, a second solder layer that exists between the first solder layer and the second member, and a third solder layer that is positioned between the second solder layer and the second member.
Career Highlights
Bunsuke Ogawa is currently associated with NEC Space Technologies, Ltd. His work at this company has allowed him to apply his expertise in solder joint technology to various projects, contributing to advancements in the field.
Conclusion
Bunsuke Ogawa's innovative work in lead solder joint technology exemplifies the importance of addressing challenges in manufacturing processes. His patent reflects a commitment to improving joint strength and reliability, making a significant impact in the industry.
Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.