This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2011.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2011
Title: Bum-Woo Lee: Innovator in Semiconductor Technology
Introduction
Bum-Woo Lee is a notable inventor based in Asan-si, South Korea. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique apparatus that enhances the efficiency of semiconductor chip bonding.
Latest Patents
Bum-Woo Lee holds a patent for a semiconductor chip bonding apparatus. This apparatus is designed to maintain a semiconductor chip in a parallel state with respect to a lead frame when applying a bonding load. This innovation is crucial for improving the reliability and performance of semiconductor devices.
Career Highlights
Bum-Woo Lee is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to be at the forefront of semiconductor research and development. With 1 patent to his name, he has established himself as a key player in the industry.
Collaborations
Throughout his career, Bum-Woo Lee has collaborated with talented individuals such as Cheal-Sang Yoon and Yong-Dae Ha. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Bum-Woo Lee's contributions to semiconductor technology exemplify the spirit of innovation. His work not only advances the field but also sets a standard for future developments in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile