Company Filing History:
Years Active: 2002-2004
Title: Innovations by Buddhika J Abesingha
Introduction
Buddhika J Abesingha is a notable inventor based in Plano, Texas. He has made significant contributions to the field of semiconductor technology, particularly in minimizing package-shift effects in integrated circuits. His work has led to the development of innovative solutions that enhance the performance and reliability of electronic devices.
Latest Patents
Buddhika holds two patents, both focused on semiconductor devices. His latest patents include a semiconductor device that minimizes package-shift effects in integrated circuits by using a thick metallic overcoat. This invention employs a layer of electrolytically deposited copper approximately 15 µm thick, which is patterned to create electrically independent regions. An unbroken area of the metallic overcoat is strategically left over sensitive analog circuitry, such as a bandgap reference circuit. This thick metallic coating not only minimizes package-shift effects but also serves as a low-resistance routing layer, allowing for low-profile packaging.
Career Highlights
Buddhika is currently employed at Texas Instruments Corporation, a leading company in the semiconductor industry. His work at Texas Instruments has been instrumental in advancing the company's technological capabilities and product offerings. His innovative approaches have contributed to the development of more efficient and reliable electronic components.
Collaborations
Buddhika has collaborated with several talented individuals in his field, including Gabriel Alfonso Ricon-Mora and David D Briggs. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Buddhika J Abesingha is a prominent inventor whose work in semiconductor technology has led to significant advancements in integrated circuits. His innovative patents and contributions to Texas Instruments Corporation highlight his expertise and commitment to enhancing electronic device performance.