Company Filing History:
Years Active: 2015-2017
Title: Innovations by Bryan Puch: A Remarkable Journey in Wafer Processing
Introduction: Bryan Puch, an accomplished inventor based in Kalispell, MT, has made significant contributions to the field of wafer processing technology. With three patents to his name, Bryan's inventions reflect his dedication to advancing electroplating processes, enhancing efficiency, and improving equipment maintenance.
Latest Patents: Bryan's latest patents include a groundbreaking wafer processing system featuring a chuck assembly maintenance module. This system allows for the seamless loading of wafers into the chuck assembly while providing capabilities for inspecting and cleaning the chuck utilized in electroplating processors. The innovative design includes a rotor plate connected to a shaft, with a rotation motor enabling dynamic movement of the assembly. A lift motor provides precise control for raising and lowering the rotor plate during the wafer loading and unloading process.
Another notable patent is the electroplating apparatus with a contact ring deplating mechanism. This invention incorporates a rotor within a head and employs an actuator to adjust the position of a sector of the contact ring into a deplate channel at the deplating station. The unique approach of applying electrical current and deplate liquid both directly on the contacts and from the backside of the contact ring represents a significant innovation in the electroplating field.
Career Highlights: Bryan Puch conducts his innovative work at Applied Materials, Inc., where he continues to push the boundaries of technology in wafer processing and electroplating systems. His career is marked by a commitment to excellence and pioneering advancements that benefit the semiconductor industry.
Collaborations: Collaboration has been essential to Bryan's success. He has worked closely with esteemed colleagues such as Randy Harris and Jason A Rye, leveraging their expertise to enhance his inventions and drive improvements in production processes.
Conclusion: Bryan Puch exemplifies the spirit of innovation in the semiconductor industry. His patents showcase his remarkable ability to address complex challenges in wafer processing systems and electroplating technology. As he continues to innovate at Applied Materials, Inc., the impact of his work will undoubtedly resonate throughout the industry for years to come.