Company Filing History:
Years Active: 2011-2014
Title: Innovations of Bryan Irwin in 3D Circuit Manufacturing
Introduction
Bryan Irwin is an accomplished inventor based in Winter Springs, FL (US). He has made significant contributions to the field of electronic circuit manufacturing, particularly in the area of three-dimensional circuits. With a total of two patents to his name, Irwin's work showcases his innovative approach to technology.
Latest Patents
Bryan Irwin's latest patents focus on a method for manufacturing 3D circuits from bare die or packaged IC chips through microdispensed interconnections. This method allows for the interconnection of electronic components within a circuit by directly writing conducting lines in three-dimensional space. The process involves observing a direct writing tool using a vision system, determining the proper placement of the tool, and directly writing conducting lines either on a surface or in free space. Additionally, the method includes stacking multiple chips to create a stack with a top surface and edges, interconnecting the chips by writing conducting lines along the edges.
Career Highlights
Irwin is currently employed at Nscrypt, Inc., where he continues to develop innovative solutions in electronic manufacturing. His work has been instrumental in advancing the capabilities of 3D circuit technology, making significant strides in the efficiency and effectiveness of electronic component interconnections.
Collaborations
Throughout his career, Bryan Irwin has collaborated with notable colleagues, including Kenneth H Church and Patrick A Clark. These partnerships have contributed to the development of cutting-edge technologies in the field.
Conclusion
Bryan Irwin's contributions to the field of 3D circuit manufacturing highlight his innovative spirit and dedication to advancing technology. His patents reflect a commitment to improving electronic circuit design and manufacturing processes.