Hopewell Junction, NY, United States of America

Bruno T Klingel


Average Co-Inventor Count = 7.0

ph-index = 2

Forward Citations = 217(Granted Patents)


Company Filing History:


Years Active: 1991-1992

where 'Filed Patents' based on already Granted Patents

2 patents (USPTO):

Title: Inventor Spotlight: Bruno T. Klingel

Introduction

Bruno T. Klingel is a prominent inventor based in Hopewell Junction, NY, known for his innovative contributions to the field of connector structures in electronic substrates. With a total of two patents under his name, Klingel has significantly impacted the development of soldering techniques and methods for ensuring reliable electronic connections.

Latest Patents

Klingel's latest patent focuses on an interconnection structure and a testing method. This invention discloses a connector structure on a substrate featuring at least one first solder portion on the surface. Each of the first solder portions is connected to at least one second solder portion. An epoxy layer surrounds the first and second solder portions, covering the first while allowing the second to remain exposed, facilitating testing and enhancing solderability. Notably, the patent also includes a connector structure with solder ball portions, where the melting point of the second solder ball portion is relatively higher than that of the first, ensuring better integrity in high-temperature environments.

Career Highlights

Bruno T. Klingel is associated with the International Business Machines Corporation (IBM), a global leader in technology and innovation. His work at IBM has placed him at the forefront of developing new electronic connectivity solutions, contributing to the company's reputation for cutting-edge technology and quality.

Collaborations

Klingel has collaborated with notable colleagues, including John R. Behun and Anson Jay Call. Their joint efforts within IBM have led to advancements in technology that have broad applications in the industry.

Conclusion

Bruno T. Klingel's contributions to the field of connector structures have demonstrated his commitment to innovation and excellence. With his expertise and collaborative spirit, he continues to influence the technology landscape, helping to pave the way for future advancements in electronic connections.

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