LaGrangeville, NY, United States of America

Bruce E Blake


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 78(Granted Patents)


Company Filing History:


Years Active: 1988

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1 patent (USPTO):

Title: The Innovations of Bruce E. Blake: A Pioneer in Ceramic Card Technology

Introduction: Bruce E. Blake, a skilled inventor based in LaGrangeville, NY, has made significant contributions to the field of semiconductor packaging. With a profound understanding of thermal management and power distribution challenges in electronics, he has pioneered innovations that push the boundaries of technology.

Latest Patents: Bruce holds a patent titled "Ceramic card assembly having enhanced power distribution and cooling." This innovation presents a ceramic card assembly designed to provide high-density three-dimensional semiconductor device packaging. The assembly effectively addresses power distribution and thermal management issues that have previously hindered ceramic card performance. By integrating flexible power distribution structures with ceramic cards, Bruce's invention offers a solution that ensures low inductance and low resistance power distribution. The unique construction of the ceramic card assembly enables it to support high-performance Very Large Scale Integration (VLSI) systems.

Career Highlights: Bruce E. Blake is associated with International Business Machines Corporation (IBM), a leader in technology and innovation. Throughout his career, he has been instrumental in developing advanced semiconductor technology. His research focuses on enhancing the efficiency and reliability of electronic devices through improved packaging methods.

Collaborations: In his innovative journey, Bruce has collaborated with esteemed colleagues, including Eric B. Hultmark and Frank P. Presti. Together, they have explored the intricate demands of thermal management and power distribution in semiconductor assemblies. Their teamwork reflects a shared vision of advancing technology for the benefit of modern electronics.

Conclusion: Bruce E. Blake's contributions to ceramic card technology have paved the way for more efficient high-density semiconductor packaging. His innovative designs and collaborative efforts with talented coworkers demonstrate his commitment to improving electronic performance. As the technology landscape continues to evolve, Bruce's work remains pivotal in shaping the future of VLSI systems and semiconductor applications.

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