Brian W Saxton

Title: Brian W. Saxton: Innovator in Co-Fired Metal-Ceramic Packages

Introduction

Brian W. Saxton is a notable inventor based in Norwell, MA (US). He has made significant contributions to the field of materials science, particularly in the development of co-fired metal-ceramic packages. His innovative work has led to advancements in integrated circuit technology.

Latest Patents

Saxton holds a patent for a co-fired metal-ceramic package. This invention involves glass-ceramic packages for integrated circuits that contain multi-layer, interconnected thick film wiring patterns. The process includes co-sintering a glass-ceramic composite with conductors such as copper, silver, palladium, and gold at temperatures not exceeding about 1000°C. The dielectric systems utilized in this invention comprise composites of borosilicate glasses and crystalline fillers, which can be fabricated through mixing glass frit and the filler or by a sol-gel coating process. The package is designed using a tape that ensures clean binder burnout in a reducing atmosphere at low temperatures, providing superior mechanical and thermal properties. The metallization process employs thick film screening techniques with glass-ceramic bonding agents that enhance adhesion while maintaining the desired electrical properties.

Career Highlights

Brian W. Saxton is associated with Ceramics Process Systems Corporation, where he has been instrumental in advancing ceramic materials for electronic applications. His expertise in the field has positioned him as a key figure in the development of innovative packaging solutions for integrated circuits.

Collaborations

Throughout his career, Saxton has collaborated with notable colleagues, including Eric A. Barringer and Sheldon I. Lieberman. These partnerships have contributed to the successful development and implementation of his patented technologies.

Conclusion

Brian W. Saxton's contributions to the field of co-fired metal-ceramic packages have significantly impacted the technology behind integrated circuits. His innovative approach and dedication to research continue to influence advancements in materials science.