Brian P Balut

Title: Brian P Balut: Innovator in Semiconductor Packaging

Introduction

Brian P Balut is a notable inventor based in Mount Dora, FL (US). He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through his innovative designs and patents. His work is particularly recognized for enhancing the functionality and efficiency of semiconductor devices.

Latest Patents

Brian P Balut holds a patent for a "Semiconductor package with lid having lid conductive structure." This invention relates to a semiconductor package that includes a lid featuring a conductive structure. The design incorporates a substrate with a top surface, a lid positioned over the substrate, and at least one component mounted on the substrate's surface. A cavity is defined within the lid, which is strategically placed over the substrate. The substrate is equipped with a metal pad, while the lid contains a conductive structure that includes both a body conductor and a wall conductor, ensuring electronic coupling to the metal pad.

Career Highlights

Brian is currently employed at Qorvo US, Inc., where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor packages, making them more efficient and reliable.

Collaborations

Throughout his career, Brian has collaborated with esteemed colleagues such as Jonathan J Fain and Kevin J Anderson. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Brian P Balut is a distinguished inventor whose contributions to semiconductor packaging have made a lasting impact on the industry. His innovative patent and collaborative efforts highlight his commitment to advancing technology in this vital field.