Company Filing History:
Years Active: 2025
Title: Brian M Koronkiewicz: Innovator in Underwater Adhesives
Introduction
Brian M Koronkiewicz is a notable inventor based in Pasadena, MD (US). He has made significant contributions to the field of adhesives, particularly with his innovative approach to underwater applications. His work is characterized by a focus on enhancing the performance and reliability of adhesives used in challenging environments.
Latest Patents
One of Brian's key patents is titled "Microcapsules for use with polyurethane and epoxy adhesives." This invention involves a microcapsule designed for underwater adhesives, featuring a shell composed of nanoclay platelets and a polyurea product derived from the interfacial polymerization of a polyamine and an aromatic polyisocyanate. The core composition of the microcapsule includes a base catalyst for the formation of polyurethane, a polyol, and a hydrophilic solvent. This innovative design aims to improve the effectiveness of adhesives in underwater conditions.
Career Highlights
Brian M Koronkiewicz is affiliated with The Johns Hopkins University, where he has been able to leverage his expertise in materials science and engineering. His work at this prestigious institution has allowed him to collaborate with other leading researchers and contribute to advancements in adhesive technologies.
Collaborations
Throughout his career, Brian has worked alongside talented colleagues, including Christopher M Hoffman, Jr and Reid E Messersmith. These collaborations have fostered a dynamic research environment, leading to innovative solutions in the field of adhesives.
Conclusion
Brian M Koronkiewicz is a distinguished inventor whose work on microcapsules for underwater adhesives showcases his commitment to advancing adhesive technology. His contributions continue to impact the industry positively, demonstrating the importance of innovation in challenging applications.