Brian K Smith

Title: Innovations of Brian K Smith

Introduction

Brian K Smith is a notable inventor based in Marion, IA (US), recognized for his contributions to the field of optically clear adhesive (OCA) technologies. With a total of 8 patents to his name, Smith has made significant advancements in the methods of laminating materials, particularly in the production of laminated OCA assemblies.

Latest Patents

Among his latest patents is a method for creating a laminated optically clear adhesive assembly. This innovative process involves providing two OCA components of different thicknesses and laminating them together using a roll to roll lamination technique. The method ensures that the nip roller pressure is adjusted based on the combined thickness of the components, allowing for a more efficient and effective lamination process.

Career Highlights

Throughout his career, Brian K Smith has worked with prominent companies such as Rockwell Collins, Inc. and Rockwell International Corporation. His experience in these organizations has contributed to his expertise in the field of adhesive technologies and manufacturing processes.

Collaborations

Some of his notable coworkers include James D Sampica and Gary N Prior, who have collaborated with him on various projects throughout his career.

Conclusion

Brian K Smith's innovative work in the field of optically clear adhesives has led to significant advancements in lamination techniques. His contributions continue to influence the industry and showcase the importance of innovation in technology.