Port Washington, WI, United States of America

Brian J Smith


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 1983

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1 patent (USPTO):Explore Patents

Title: **Brian J. Smith: Innovator in Vibratory Plate Technology**

Introduction

Brian J. Smith, an inventive mind based in Port Washington, Wisconsin, has made significant contributions to the field of engineering with a focus on vibratory systems. With one patent to his name, his work emphasizes innovative methods that enhance the efficiency of industrial processes.

Latest Patents

Brian J. Smith holds a patent for a "Method and apparatus for applying a thin liquid film to a vibratory plate." This invention introduces a novel method for applying a thin film of liquid to a vibratory plate, which is essential in compaction processes. The apparatus he developed incorporates a container assembly that holds the liquid close to the plate, allowing for a low-velocity laminar flow that enhances the surface contact through the principle of surface tension. This innovation showcases the potential for increased effectiveness in various industrial applications.

Career Highlights

Smith has cultivated a notable career at Koehring Company, where he has contributed to the advancement of engineering practices in vibratory technology. His patent represents a significant achievement, highlighting his dedication to improving methods in the industry. His innovative spirit and commitment to technical advancement are evident in his work.

Collaborations

Throughout his career, Brian has worked alongside distinguished colleagues like Wayne P. Zemke and Clyde M. Maki. Collaborating with talented individuals has likely enriched his perspective and contributed to the successful development of his inventions. Their combined expertise has played a role in fostering a creative environment conducive to innovation.

Conclusion

Brian J. Smith stands out as a key inventor in the realm of vibratory plate technology. His patented method for applying a thin liquid film not only demonstrates his ingenuity but also holds the potential to revolutionize industrial applications. Through his efforts and collaborations, Smith continues to contribute meaningfully to advancements in engineering.

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