Company Filing History:
Years Active: 2006-2007
Title: Brian F. Conaghan: Innovator in Conductive Ink Technologies
Introduction
Brian F. Conaghan is a notable inventor based in Princeton, NJ (US). He has made significant contributions to the field of conductive inks, holding 2 patents that focus on improving the performance and application of these materials. His work is particularly relevant in industries that require high conductivity and adhesion in printed electronics.
Latest Patents
Conaghan's latest patents include innovative formulations for conductive inks. The first patent, titled "High conductivity inks with improved adhesion," describes conductive ink compositions that can be cured to form highly conductive metal traces through a process known as 'chemical welding.' This invention incorporates adhesion-promoting additives that enhance the ink's ability to bond with various substrates. The second patent, "High conductivity inks with low minimum curing temperatures," presents conductive ink compositions that can also be cured to create conductive traces but with the added benefit of lower curing temperatures. This is particularly advantageous for applications involving low-temperature substrates, as it allows for the deposition of conductive inks on surfaces coated with a curing temperature-reducing agent.
Career Highlights
Brian F. Conaghan is currently associated with Parelec, Inc., a company that specializes in advanced conductive materials. His role at Parelec has allowed him to further develop his expertise in conductive inks and their applications in various electronic devices.
Collaborations
Throughout his career, Conaghan has collaborated with notable colleagues, including Paul Harriman Kydd and David L. Richard. These partnerships have contributed to the advancement of conductive ink technologies and have fostered innovation within the field.
Conclusion
Brian F. Conaghan's work in conductive inks exemplifies the intersection of innovation and practical application in modern technology. His patents reflect a commitment to enhancing the performance of conductive materials, making significant strides in the field of printed electronics.