North York, Canada

Brian C Derdall


Average Co-Inventor Count = 9.0

ph-index = 1

Forward Citations = 56(Granted Patents)


Company Filing History:


Years Active: 1993

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1 patent (USPTO):Explore Patents

Title: Innovations of Brian C Derdall in High Density Memory Circuits

Introduction

Brian C Derdall, an accomplished inventor based in North York, Canada, has made significant contributions to the field of memory circuit technology. With one patent to his name, he demonstrates expertise in designing innovative solutions that enhance the performance of electronic devices. He is associated with the renowned International Business Machines Corporation (IBM).

Latest Patents

Derdall's notable patent is centered around a high density, high performance memory circuit package. This invention involves a unique design featuring a pair of planar packages positioned back-to-back. Each package includes a flexible circuit carrier with multiple circuit chips mounted on it. The inclusion of front and back planar metallic heat sinks enables efficient heat management, ensuring the performance and longevity of the memory circuit. The innovative design incorporates air flow apertures to facilitate cooling, contributing to the overall efficiency of the electronic systems utilizing the circuit package.

Career Highlights

Throughout his career at IBM, Brian C Derdall has focused on advancements in circuit technology, paving the way for improved electronic devices. His specialization in high-density circuit packaging reflects a commitment to enhancing device performance. His work in this cutting-edge field marks him as a notable figure in technological innovation.

Collaborations

Derdall has collaborated with prominent colleagues in the technology sector, including Thomas Mario Cipolla and Paul William Coteus. These collaborations have fostered an environment of innovation and creativity, leading to advancements that benefit the greater field of electronics.

Conclusion

In summary, Brian C Derdall's innovative patent for a high density, high performance memory circuit package highlights his valuable contributions to the electronics industry. His work at IBM, along with collaborations with esteemed colleagues, positions him as an influential inventor dedicated to advancing technology through inventive solutions.

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