Quincy, MI, United States of America

Brian C Bowerman

USPTO Granted Patents = 12 

Average Co-Inventor Count = 2.4

ph-index = 4

Forward Citations = 63(Granted Patents)


Company Filing History:


Years Active: 2001-2024

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12 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Brian C Bowerman

Introduction

Brian C Bowerman is a notable inventor based in Quincy, MI (US), recognized for his significant contributions to packaging technology. With a total of 12 patents to his name, Bowerman has developed innovative solutions that enhance efficiency in food packaging and processing.

Latest Patents

Among his latest patents is a packaging machine and apparatus designed for feeding cup-like containers. This apparatus features a first and second infeed tower, each equipped with a stationary upper segment and a movable lower segment. The movable lower segment can transition between a load position for receiving containers and an unload position for delivering them to a packaging station. Additionally, Bowerman has developed a deli slicer and packaging system, which automates the cutting, packaging, and labeling of food items. This device includes a computerized input that allows users to customize their food products according to specific preferences.

Career Highlights

Throughout his career, Bowerman has worked with various companies, including Rennco LLC, where he has applied his expertise in packaging technology. His innovative designs have contributed to advancements in the food industry, streamlining processes and improving product delivery.

Collaborations

Bowerman has collaborated with notable individuals in his field, including Robin G Thurgood and Joseph C Spencer. These partnerships have fostered a creative environment that encourages the development of cutting-edge solutions in packaging technology.

Conclusion

Brian C Bowerman's work exemplifies the spirit of innovation in the packaging industry. His patents and collaborative efforts have made a lasting impact on food processing and packaging technologies.

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