Oviedo, FL, United States of America

Brandon T Dubas


 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Innovations by Brandon T Dubas

Introduction

Brandon T Dubas is an accomplished inventor based in Oviedo, FL (US). He has made significant contributions to the field of technology, particularly in the area of thermal interface enhancement for electronic modules. His innovative approach has led to the development of a unique patent that addresses critical challenges in electronic module insertion.

Latest Patents

Brandon holds a patent for "Systems and methods for heatsink to rail thermal interface enhancement." This patent outlines systems and methods for inserting an electronic module into a structure. The methods involve sliding at least one glide mechanism on a rail of the structure or a surface of the electronic module during the insertion process. The invention includes actuating a coupler to secure the electronic module to the rail while compressing a thermal interface material between the electronic module and the rail. This innovative design ensures that the glide mechanism is retracted into the electronic module or rail as the coupler is actuated, enhancing the efficiency of the thermal interface material.

Career Highlights

Brandon T Dubas has made a name for himself in the technology sector through his work at Eagle Technology, LLC. His expertise in thermal management solutions has positioned him as a valuable asset to the company. With a focus on innovation, he continues to push the boundaries of what is possible in electronic module design.

Collaborations

Brandon collaborates with talented individuals such as Jason Thompson and Bernie J Gilley. Their combined efforts contribute to the advancement of technology and the successful implementation of innovative solutions.

Conclusion

Brandon T Dubas exemplifies the spirit of innovation through his patent and work at Eagle Technology, LLC. His contributions to thermal interface enhancement are paving the way for future advancements in electronic module technology.

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