Brad Banister

Title: Brad Banister - Innovator in Circuit Layer Interconnection

Introduction

Brad Banister is a notable inventor based in Costa Mesa, CA (US). He has made significant contributions to the field of circuit layer interconnection through his innovative patent. His work focuses on enhancing the reliability and efficiency of electronic components.

Latest Patents

Brad Banister holds a patent for a unique bond-ply structure and associated processes for the interconnection of circuit layer pairs using conductive inks. This invention allows for the creation of a bond-ply that features raised structures of conductive material. These structures effectively compensate for shrinkage during the sintering process, resulting in a stress-free and void-free electrically conductive junction between layer pairs in an interconnect.

Career Highlights

Throughout his career, Brad has demonstrated a commitment to advancing technology in the electronics sector. His innovative approach to circuit layer interconnection has positioned him as a key figure in the industry. His patent reflects his dedication to solving complex engineering challenges.

Collaborations

Brad has worked alongside talented individuals such as Scott Moore Zimmerman and Richard J Pommer. Their collaborative efforts have contributed to the development of cutting-edge technologies in the field.

Conclusion

Brad Banister's contributions to the field of circuit layer interconnection through his innovative patent highlight his role as a significant inventor. His work continues to influence advancements in electronic component design and manufacturing.