Bowei Zhang

Title: Bowei Zhang: Innovator in Flexible IC and Microfluidic Integration

Introduction

Bowei Zhang is a prominent inventor based in Arlington, VA (US). He has made significant contributions to the field of flexible integrated circuits and microfluidic systems. His innovative approach has led to the development of a unique hybrid integration method that enhances the functionality of electronic devices.

Latest Patents

Bowei Zhang holds a patent for a groundbreaking invention titled "Flexible IC/microfluidic integration and packaging." This patent describes a method and resulting device that utilizes a single flexible elastomer substrate, such as polydimethylsiloxane (PDMS). The invention features dedicated microchannels filled with liquid metals or low melting point solders, which provide electrical interconnects to a solid-state IC die, such as CMOS. Additionally, it includes microchannels for hybrid integration with microfluidics without requiring any post-processing on the IC die. The liquid metal used in this innovative design can be a gallium-indium-tin eutectic alloy, commonly known as Galinstan.

Career Highlights

Bowei Zhang is affiliated with Washington University, where he continues to advance research in flexible electronics and microfluidic systems. His work has garnered attention for its potential applications in various fields, including biomedical devices and advanced electronic systems.

Collaborations

Bowei collaborates with notable colleagues, including Zhenyu Li and Mona Zaghloul. Their combined expertise contributes to the advancement of research in their respective fields.

Conclusion

Bowei Zhang's innovative work in flexible IC and microfluidic integration showcases his commitment to advancing technology. His contributions are paving the way for future developments in electronic and biomedical applications.