Location History:
- Yongin, KR (2005)
- Yongin-si, KR (2006)
Company Filing History:
Years Active: 2005-2006
Title: Innovations of Bong-hui Lee
Introduction
Bong-hui Lee is a notable inventor based in Yongin-si, South Korea. He has made significant contributions to the field of electronics, particularly in the development of flexible printed circuit boards and semiconductor packaging technologies. With a total of two patents to his name, Lee's work showcases his innovative approach to solving complex engineering challenges.
Latest Patents
One of Bong-hui Lee's latest patents is for a flexible printed circuit board (FPCB) designed to prevent short circuits caused by cracks in bending portions. This FPCB features an end portion, a bending portion extending from the end, and a circuit portion that extends from the bending portion. The design includes a flexible base film with strategically placed via-holes and conductive layers that enhance its reliability and performance.
Another significant patent involves a lead frame strip and a method for manufacturing semiconductor packages. This invention includes a lead frame panel with multiple unit lead frames arranged in a matrix. Each unit lead frame is equipped with a die pad for semiconductor chip mounting, along with various structural components that ensure stability and functionality during the manufacturing process.
Career Highlights
Bong-hui Lee is currently employed at Samsung Techwin Co., Ltd., where he continues to innovate and contribute to advancements in technology. His work at Samsung Techwin has positioned him as a key player in the development of cutting-edge electronic components.
Collaborations
Lee collaborates with talented coworkers, including Deok-heung Kim and Sang-kyun Lee, who share his passion for innovation and technology. Together, they work on projects that push the boundaries of what is possible in the electronics industry.
Conclusion
Bong-hui Lee's contributions to the field of electronics through his patents and work at Samsung Techwin Co., Ltd. highlight his role as an influential inventor. His innovative designs in flexible printed circuit boards and semiconductor packaging continue to impact the industry positively.