Company Filing History:
Years Active: 2010
Title: The Innovations of Bob Cheng
Introduction: Bob Cheng is a notable inventor based in Taipei Hsien, Taiwan. He has made significant contributions to the field of electronics, particularly in the area of electrostatic discharge protection. With one patent to his name, Cheng's work exemplifies the innovative spirit that drives technological advancement.
Latest Patents: Cheng's most recent patent is an electrostatic discharge protection circuit. This invention features a substrate with a first P-well that includes a first P+-doped region and a first N+-doped region, both connected to ground. Additionally, a second P-well is installed on the substrate, which contains a second P+-doped region and a second N+-doped region, both linked to a power supply voltage. Furthermore, a third P-well is incorporated, featuring a third N+-doped region, a third P+-doped region, and a fourth N+-doped region, all designed for input/output signals.
Career Highlights: Bob Cheng is currently employed at Via Technologies, Inc., where he continues to innovate and develop new technologies. His work at the company has allowed him to apply his expertise in electronics and contribute to various projects that enhance product performance and reliability.
Collaborations: Cheng has worked alongside talented colleagues such as Tony Ho and Bouryi Sze. Their collaborative efforts have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion: Bob Cheng's contributions to the field of electronics, particularly through his patent for an electrostatic discharge protection circuit, highlight his innovative capabilities. His work at Via Technologies, Inc. and collaborations with fellow inventors further emphasize his commitment to advancing technology.