Company Filing History:
Years Active: 2020
Title: Bo-yun Kim: Innovator in Chemical Mechanical Polishing
Introduction
Bo-yun Kim is a notable inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor manufacturing, particularly through his innovative work on slurry compositions for chemical mechanical polishing (CMP).
Latest Patents
Bo-yun Kim holds a patent for a slurry composition for chemical mechanical polishing, which includes a complex compound of both fullerenol and alkylammonium hydroxide. This slurry composition exhibits excellent polishing properties and can be prepared at low cost in large quantities. The patent also details a method for preparing the slurry composition, which involves obtaining a mixture of a fullerenol complex compound and unreacted hydrogen peroxide by reacting alkylammonium hydroxide, hydrogen peroxide, and fullerene. The process includes removing the unreacted hydrogen peroxide by adding hydrogen peroxide decomposition catalyst particles, followed by filtration to separate the catalyst particles. Additionally, the patent describes a method for fabricating a semiconductor device that utilizes this slurry composition.
Career Highlights
Bo-yun Kim is currently employed at Samsung Electronics Co., Ltd., where he continues to advance his research and development efforts in semiconductor technologies. His work has been instrumental in improving the efficiency and effectiveness of semiconductor device fabrication.
Collaborations
Throughout his career, Bo-yun Kim has collaborated with notable colleagues, including Kenji Takai and Do-Yoon Kim. These collaborations have further enriched his research and contributed to the development of innovative solutions in the semiconductor industry.
Conclusion
Bo-yun Kim's contributions to the field of chemical mechanical polishing and semiconductor device fabrication highlight his role as a key innovator. His patent and ongoing work at Samsung Electronics Co., Ltd. demonstrate his commitment to advancing technology in this critical area.
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