Bin Wang

Title: Innovations of Bin Wang in Polymer Deposition Technology

Introduction

Bin Wang is an accomplished inventor based in Troy, NY (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of polymer deposition. His innovative approach has led to advancements that enhance the efficiency of polymer film applications.

Latest Patents

Bin Wang holds a patent titled "Increase of deposition rate of vapor deposited polymer by electric field." This patent describes a method for depositing a polymer film onto a semiconductor wafer. The process involves connecting the wafer to one terminal of a voltage source and an electrode to the other terminal, creating a parallel plate capacitor. An electric field is generated between the electrode and the substrate, allowing for the controlled deposition of polymer films at an enhanced rate.

Career Highlights

Bin Wang is affiliated with Rensselaer Polytechnic Institute, where he continues to engage in research and development. His work focuses on improving the deposition processes for semiconductor applications, contributing to the advancement of technology in this critical field.

Collaborations

Some of his notable coworkers include John F. McDonald and Toh-Ming Lu. Their collaborative efforts have further enriched the research environment at Rensselaer Polytechnic Institute.

Conclusion

Bin Wang's innovative work in polymer deposition technology exemplifies the impact of research on semiconductor manufacturing. His contributions continue to influence the industry and pave the way for future advancements.