Bin Liu

Title: Innovations of Bin Liu in Silver Nanowire Technology

Introduction

Bin Liu is a prominent inventor based in Shaanxi, China. He has made significant contributions to the field of nanotechnology, particularly in the development of methods for printing silver nanowire harness network structures. His innovative approach has the potential to enhance the performance of various electronic devices.

Latest Patents

One of Bin Liu's notable patents is titled "Method for printing silver nanowire harness network structure by using glue dispenser." This patent discloses a method that involves constructing an induced PET substrate through a surface hydrophobic treatment. This treatment enhances the binding force between nanowires and the PET substrate, thereby improving the conductivity of the nanowire network structure. The method also includes the construction of a glue dispensing printing system, which allows for precise control over the printing process, including the movement speed and glue dispensing parameters.

Career Highlights

Bin Liu is affiliated with Xi'an Jiaotong University, where he continues to engage in research and development in the field of nanotechnology. His work has garnered attention for its practical applications in electronics and materials science. With a total of 1 patent, Liu's contributions are paving the way for advancements in the industry.

Collaborations

Bin Liu has collaborated with several colleagues, including Jianlei Cui and Chenchen Huang. Their combined expertise has furthered research initiatives and innovation in their respective fields.

Conclusion

Bin Liu's innovative methods in silver nanowire technology represent a significant advancement in nanotechnology. His work not only enhances the understanding of nanowire applications but also contributes to the development of more efficient electronic devices.