Company Filing History:
Years Active: 2018-2023
Title: The Innovations of Billy R Bodiford
Introduction
Billy R Bodiford is an accomplished inventor based in White Oak, Texas. He has made significant contributions to the field of polymer technology, holding three patents to his name. His work focuses on developing advanced polymeric substrates that have practical applications in various industries.
Latest Patents
One of Bodiford's latest patents is for a polymeric substrate that includes a barrier layer. This innovative substrate comprises a polymeric material that consists of about 50 wt. % or more of at least one polyolefin polymer and 50 wt. % or less of a hydrocarbon resin. The polymeric material exhibits a heat distortion temperature under load (DTUL) of 30°C or more, along with a tensile modulus of 500 MPa or more and/or a flexural secant modulus of 500 MPa or more. The barrier layer has a thickness ranging from greater than 200 micrometers to 6,500 micrometers. Additionally, a shaped polymeric article that incorporates this polymeric substrate is also disclosed in his patent.
Career Highlights
Throughout his career, Bodiford has worked with various companies, including Inv Polypropylene, LLC. His expertise in polymer technology has allowed him to develop innovative solutions that address industry needs. His patents reflect his commitment to advancing the field and providing valuable contributions to material science.
Collaborations
Bodiford has collaborated with notable professionals in his field, including Ross Michael Mahan and Thoi H Ho. These collaborations have likely enriched his work and contributed to the success of his inventions.
Conclusion
Billy R Bodiford is a notable inventor whose work in polymer technology has led to significant advancements in the industry. His patents demonstrate his innovative spirit and dedication to improving material applications.