Company Filing History:
Years Active: 2002-2003
Title: Bhola De: Innovator in Wafer Demount Technology
Introduction
Bhola De is a notable inventor based in Congers, NY (US), recognized for his contributions to semiconductor technology. He holds a total of four patents, showcasing his innovative spirit and technical expertise in the field.
Latest Patents
One of Bhola De's latest patents is the "Wafer Demount Receptacle for Separation of Thinned Wafer from Mounting Carrier." This invention features a substantially circular plate member with an upstanding rim structure. The rim structure is designed with a stepped configuration, which includes a first step with a defined diameter and a second step with a greater diameter. The low height of the first step creates a gap that limits the bending of the fragile semiconductor wafer during the demounting process. Additionally, the plate member is equipped with a pattern of holes that generates eddy currents in a solvent, facilitating the softening and dissolving of the adhesive that bonds the wafer to the carrier. This innovative receptacle can be used in conjunction with a wafer demount tool, which enhances the separation process through the introduction of pressurized gas.
Career Highlights
Bhola De is currently employed at Anadigics, Inc., where he continues to develop cutting-edge technologies in the semiconductor industry. His work has significantly impacted the efficiency and effectiveness of wafer demounting processes.
Collaborations
Throughout his career, Bhola has collaborated with talented individuals such as Daniel Stofman and Mark Spencer Grey. These collaborations have contributed to the advancement of technology in their field.
Conclusion
Bhola De's innovative work in wafer demount technology exemplifies his commitment to advancing semiconductor processes. His patents reflect a deep understanding of the challenges in the industry and provide effective solutions for improving efficiency.