Beung Seuck Song

Title: Beung Seuck Song: Innovator in Multi-Chip Package Technology

Introduction

Beung Seuck Song is a notable inventor based in Suwon, South Korea. He has made significant contributions to the field of semiconductor packaging, particularly with his innovative designs that enhance the efficiency and stability of multi-chip packages.

Latest Patents

Beung Seuck Song holds a patent for a multi-chip package that eliminates the die pad. This design provides more room for elements within the package, allowing for a balanced inner structure. The absence of a die pad helps avoid poor molding that could expose package elements. In this package, an upper chip is bonded to the top surface of a lower chip. Auxiliary or inner leads of a lead frame attach to the top surface of the lower chip, stabilizing the chips and shortening wire lengths. This innovation reduces wire loop heights, thereby minimizing the risk of wire exposure during transfer-molding. Additionally, the patent discloses a multi-chip stack package that includes auxiliary leads, which provide stable support for semiconductor chips and prevent tilting during the molding process.

Career Highlights

Beung Seuck Song is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work focuses on advancing semiconductor technologies and improving packaging solutions.

Collaborations

He has collaborated with notable coworkers, including Kwan Jai Lee and Young Jae Song, contributing to various projects that enhance the capabilities of semiconductor packaging.

Conclusion

Beung Seuck Song's innovative approach to multi-chip package technology exemplifies the advancements in semiconductor design. His contributions continue to influence the industry, showcasing the importance of innovation in technology.