Korntal, Germany

Bernd Huettner


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:

goldMedal1 out of 832,843 
Other
 patents

Years Active: 2003

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Bernd Huettner: Innovator in Material Layer Detachment

Introduction

Bernd Huettner, based in Korntal, Germany, is a notable inventor recognized for his contribution to the field of materials engineering. With a focus on improving manufacturing processes, Huettner has developed innovative methods aimed at enhancing the efficiency and precision of material detachment techniques.

Latest Patents

Huettner holds a patent for a groundbreaking method and device for detaching a segment of a material layer. The invention is designed to produce segments from a material layer with minimal thermal stress and reduced secondary thermal effects. The method involves using a laser pulse that passes through a carrier to generate superheated matter, which aids in detaching segments while ensuring that a cohesive partial layer remains intact.

Career Highlights

Throughout his career, Bernd Huettner has demonstrated a deep commitment to advancing technology in material processing. His innovative approach has positioned him as a key figure in the industry and showcases his ability to think critically about traditional methods of material detachment.

Collaborations

Huettner has collaborated with esteemed colleagues, including Arnd Menschig and Ralf Baehnisch. These partnerships reflect his ability to work effectively within a team, fostering a collaborative environment that drives innovation.

Conclusion

Bernd Huettner's contributions to the field of material engineering, particularly through his patented method for segment detachment, underscore the importance of innovation in enhancing manufacturing processes. His work continues to inspire others in the industry, paving the way for future advancements in material technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…