Schoenaich, Germany

Bernd Garden


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 2002

where 'Filed Patents' based on already Granted Patents

1 patent (USPTO):

Title: The Innovative Work of Bernd Garden in Multilayer Electronics Packaging

Introduction: Bernd Garden, an inventive mind residing in Schoenaich, Germany, has significantly contributed to the field of electronics packaging. With a strong background in technology and engineering, he holds a key patent that reflects his innovative approach to improving electronic components.

Latest Patents: Bernd Garden's notable patent is centered around MCM—MLC technology, which presents a multilayer electronics packaging structure designed specifically for multi-chip modules. His invention enhances electronic systems by forming an overlap of signal conductors through respective mesh conductors. This innovative structure provides an improved shielding effect and minimizes coupling between signal conductors. Furthermore, by increasing the via punch pitch, enabling multiple wiring channels between adjacent vias, it improves wirability and reduces the number of signal distribution layers. These advancements culminate in better electrical properties than state-of-the-art structures, alongside a cost reduction of about 35%.

Career Highlights: Bernd's professional journey includes significant tenure at International Business Machines Corporation (IBM), where he has utilized his expertise to push the boundaries of technology. His commitment to innovation has been evident throughout his career, and his patent exemplifies the practical applications of his work.

Collaborations: In his role at IBM, Bernd collaborates with talented coworkers such as Simone Rehm and Erich Klink. Together, they contribute to cutting-edge research and development within the electronics industry, driving forward the adoption of innovative technologies.

Conclusion: Bernd Garden's impact on multilayer electronics packaging illustrates the importance of innovation in the technology sector. His patented MCM—MLC technology not only enhances electronic performance but also demonstrates a commitment to cost efficiency in manufacturing. As he continues to work alongside skilled colleagues at IBM, the future holds great potential for further advancements in the field.

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