Bernd Garben

Title: Bernd Garben: Innovator in Integrated Circuit Technology

Introduction

Bernd Garben is a notable inventor based in Schoenaich, Germany. He has made significant contributions to the field of integrated circuit technology, holding a total of 7 patents. His work focuses on enhancing the efficiency and performance of electronic components.

Latest Patents

One of Garben's latest patents is an integrated circuit current regulator. This innovative device compensates for variations in current required based on the switching activity of the integrated circuit. The first embodiment of this invention incorporates a voltage-controlled on-chip bypass circuit with a scaling unit. This unit divides an input voltage into n fractional voltages and includes an on-chip voltage monitor. The monitor compares a fraction of the on-chip supply voltage with a reference voltage to control a corresponding on-chip power supply bypass. Additionally, at least one bypass resistor per comparator is switched between the supply voltage and ground potential according to the output signal of the corresponding comparator. This design helps to dampen power supply noise. The value of the bypass resistance increases with decreasing on-chip supply voltage and decreases with increasing supply voltage. This characteristic is realized to reduce or eliminate mid-frequency power supply noise caused by on-chip switching activity variations while minimizing additional on-chip power dissipation.

Another significant patent is the module power distribution network. This multi-layer module for packaging an electronic component comprises an uppermost electrically conductive layer for mounting the component, along with a plurality of electrically insulative layers and electrically conductive layers. The conductive layers form staggered placements of at least three voltage and/or ground distribution layers close to the module surface without signal wiring layers in between. The design also includes signal distribution layers comprising signal conductors. Vias form conductive paths through the insulative layers and conductive layers, ensuring that the corresponding signal, voltage, and ground distribution layers are electrically connected with each other and with the uppermost layer.

Career Highlights

Bernd Garben is currently associated with International Business Machines Corporation (IBM), where he continues to innovate in the field of electronics. His work has had a profound impact on the development of integrated circuits and electronic components.

Collaborations

Throughout his career, Garben has collaborated with notable colleagues, including Roland Frech and Erich Klink. These collaborations have contributed to the advancement of technology in their respective fields.

Conclusion

Bernd Garben is