Poughquag, NY, United States of America

Bernard T Clark


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 144(Granted Patents)


Company Filing History:


Years Active: 1982

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Bernard T. Clark

Introduction

Bernard T. Clark is a notable inventor based in Poughquag, NY (US). He has made significant contributions to the field of integrated circuit technology. His work focuses on enhancing heat transfer mechanisms in semiconductor packages, which is crucial for the performance and reliability of electronic devices.

Latest Patents

Bernard T. Clark holds a patent for a "Heat transfer structure for integrated circuit package." This innovative design allows heat to be efficiently removed from a Large Scale Integrated Circuit semiconductor package through a thermal conductive path that includes a thermally conductive liquid. The integrated circuit chips are flip chip bonded to a substrate featuring a printed circuit and raised contact pads that interconnect with the chip's contact areas. A metal or ceramic cover encloses the chips and the substrate, creating a cavity that contains the thermal liquid. This design protects the chips and their connections from contamination and the adverse effects of the thermal liquid by using a parylene film. Additionally, the incorporation of liquid metal and a protective coating of parylene enhances the heat transfer path for back side bonded integrated circuit chips.

Career Highlights

Bernard T. Clark is associated with the International Business Machines Corporation (IBM), where he has contributed to various projects and innovations in semiconductor technology. His work has been instrumental in advancing the efficiency and effectiveness of heat management in integrated circuits.

Collaborations

Throughout his career, Bernard has collaborated with notable colleagues, including Erich Berndlmaier and Jack A. Dorler. These collaborations have fostered a creative environment that has led to significant advancements in their respective fields.

Conclusion

Bernard T. Clark's innovative work in heat transfer structures for integrated circuits exemplifies the importance of effective thermal management in modern electronics. His contributions continue to influence the development of reliable and efficient semiconductor technologies.

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