Company Filing History:
Years Active: 2020
Title: Innovations in Heat Pipe Technology by Bangcheng Al
Introduction
Bangcheng Al is an innovative inventor based in Beijing, China, known for his contributions to the field of heat pipe technology. With one patent to his name, he has demonstrated significant expertise in developing devices that optimize thermal management processes.
Latest Patents
One of Bangcheng Al's noteworthy patents is titled "Device and method for filling dual process interface heat pipe with solid working media." This invention introduces a solid working medium filling device for heat pipes equipped with dual process ports. The design includes a working medium tank, an upper cover, an inert gas source, and a vacuum molecular pump set. The upper cover features a process port that connects to both the inert gas source and the vacuum molecular pump, enhancing the efficiency of the filling process. The heat pipe being filled contains two process ports: the main process port serves as both the vacuumizing port and the working medium filling port, while the auxiliary process port functions as a vacuumizing port and an inert gas passage. This innovation allows for a doubled exhaust passage size, facilitating smooth exhausting and vacuumizing, as well as expanding the filling range based on specific requirements.
Career Highlights
Bangcheng Al is affiliated with the China Academy of Aerospace Aerodynamics, where he works alongside other esteemed professionals in advancing research and applications in aerospace technologies. His work focuses on improving the efficiency and effectiveness of heat transfer systems.
Collaborations
Throughout his career, Bangcheng has collaborated with talented coworkers such as Wei Qu and Jijun Yu. Together, they contribute to significant advancements in thermal management technologies, ensuring that their research addresses the evolving challenges in aerospace and energy efficiency.
Conclusion
With his innovative approach and dedication to research, Bangcheng Al stands out as a leading inventor in the realm of heat pipe technology. His contributions not only pave the way for more efficient thermal management solutions but also strengthen the foundations of aerospace advancements. His patent reflects the potential for future innovations that can further enhance the efficiency of heat transfer in various applications.