Bahram Afshari

Title: Innovations of Bahram Afshari

Introduction

Bahram Afshari is an accomplished inventor based in Stanford, California. He has made significant contributions to the field of integrated circuit packaging, particularly with his innovative designs that enhance thermal management.

Latest Patents

Bahram Afshari holds a patent for a "Reliable low thermal resistance package for high power flip chip ICs." This invention features a flip-chip IC package that includes a thermally-conductive lid attached to the backside of the chip by a die attach layer of a predetermined thickness range. The design incorporates a rim made from KOVAR iron-nickel alloy, which is strategically formed to optimize thermal performance. The patent outlines a method for applying thermally-filled epoxy and lid attach epoxy to ensure effective thermal conductivity and structural integrity.

Career Highlights

Throughout his career, Bahram has focused on developing advanced packaging solutions for high-power integrated circuits. His work has been instrumental in improving the reliability and efficiency of electronic devices. With one patent to his name, he continues to push the boundaries of innovation in his field.

Collaborations

Bahram has collaborated with notable colleagues, including Voddarahalli K Nagesh and Kim Hong Chen. Their combined expertise has contributed to the advancement of technologies in integrated circuit packaging.

Conclusion

Bahram Afshari's innovative work in the field of integrated circuit packaging exemplifies the importance of thermal management in electronic devices. His contributions continue to influence the industry and pave the way for future advancements.