Company Filing History:
Years Active: 2015-2019
Title: Atsushi Kitani: Innovator in Substrate Processing Technologies
Introduction
Atsushi Kitani is a notable inventor based in Nara, Japan. He has made significant contributions to the field of substrate processing technologies, holding a total of 3 patents. His work primarily focuses on methods and apparatuses that enhance the efficiency and effectiveness of substrate handling in thermal treatment chambers.
Latest Patents
One of his latest patents is titled "Method and apparatus for substrate transfer in a thermal treatment chamber." This invention relates to innovative methods for heating substrates and managing slots within a thermal treatment chamber. The process involves providing a substrate to a designated slot, heating it, and efficiently transferring it out of the chamber at a specific time for annealing.
Another significant patent is "Method and apparatus for handling substrates in a processing system having a buffer chamber." This invention outlines a method for processing substrates in a system that includes a buffer chamber. It focuses on identifying substrates that have been in the buffer chamber for an extended duration and executing a buffer time-out operation to enhance processing efficiency.
Career Highlights
Atsushi Kitani is currently employed at Applied Materials, Inc., a leading company in the field of materials engineering. His work at Applied Materials has allowed him to develop and refine technologies that are crucial for substrate processing in various applications.
Collaborations
Throughout his career, Atsushi has collaborated with talented individuals such as James Hoffman and Jaeyoung Kim. These collaborations have contributed to the advancement of innovative solutions in substrate processing technologies.
Conclusion
Atsushi Kitani's contributions to substrate processing technologies through his patents and work at Applied Materials, Inc. highlight his role as a significant innovator in the field. His inventions continue to influence the efficiency of substrate handling processes in thermal treatment chambers.