Atsushi Hamada

Title: Atsushi Hamada: Innovator in Adhesive Technologies

Introduction

Atsushi Hamada is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of adhesive technologies, holding a total of 5 patents. His work focuses on developing innovative solutions that enhance adhesion properties while minimizing skin irritation.

Latest Patents

Hamada's latest patents include a novel patch and patch preparation. This patch contains a support and an adhesive layer formed on at least one surface of the support. The adhesive layer is made from an elastomer obtained by crosslinking a polymer with a butadiene skeleton in the presence of organic peroxide. This innovation ensures that the patch maintains good adhesion properties over an extended period. Another significant patent is a pressure-sensitive adhesive sheet designed for skin application. This adhesive sheet is notable for being formed without the use of organic solvents, demonstrating superior adhesion performance to the skin while causing minimal irritation and damage to the stratum corneum.

Career Highlights

Throughout his career, Atsushi Hamada has worked with notable companies such as Nitto Denko Corporation and Kaneka Corporation. His experience in these organizations has allowed him to refine his expertise in adhesive technologies and contribute to various innovative projects.

Collaborations

Hamada has collaborated with esteemed colleagues, including Takashi Kinoshita and Kenji Furumori. These partnerships have fostered a creative environment that has led to the development of groundbreaking adhesive solutions.

Conclusion

Atsushi Hamada's contributions to adhesive technologies have made a significant impact in the field. His innovative patents reflect his commitment to enhancing adhesion properties while ensuring safety and comfort for users. His work continues to inspire advancements in adhesive applications.