Asit Rairkar

Title: Asit Rairkar: Innovator in Interface Engineering

Introduction

Asit Rairkar is a notable inventor based in Santa Clara, CA (US). He has made significant contributions to the field of engineering, particularly in the development of methods and apparatus for creating interfaces between diffusion barrier layers and seed layers.

Latest Patents

Rairkar holds a patent for "Methods and apparatus for engineering an interface between a diffusion barrier layer and a seed layer." This innovative patent addresses the formation of copper seed layers on diffusion barrier layers, such as Ta and TaN, without significant agglomeration of copper. The engineered interface includes an adhesion layer that physically traps copper atoms, preventing their migration and agglomeration. The adhesion layer consists of approximately 20-80% atomic copper, which serves as nucleation sites during the deposition of the copper seed layer. This process allows for the deposition of thin, continuous, and conformal seed layers on top of the adhesion layer, achieved through the intermixing of diffusion barrier and seed layer materials using PVD and/or ALD techniques.

Career Highlights

Asit Rairkar is currently employed at Novellus Systems Incorporated, where he continues to push the boundaries of innovation in his field. His work has been instrumental in advancing technologies related to semiconductor manufacturing and materials science.

Collaborations

Rairkar has collaborated with notable colleagues, including Alexander Dulkin and Frank Greer, contributing to a dynamic and innovative work environment.

Conclusion

Asit Rairkar's contributions to engineering and technology exemplify the spirit of innovation. His patent on interface engineering showcases his expertise and commitment to advancing the field.