Arthur Khoon Siah Ang

Title: Innovations of Arthur Khoon Siah Ang

Introduction

Arthur Khoon Siah Ang is a notable inventor based in Singapore, recognized for his contributions to the field of materials science. He has developed innovative methods that enhance the adhesion of metals to polyimides, which are crucial in various industrial applications.

Latest Patents

Arthur Khoon Siah Ang holds a patent for a "Method for low temperature lamination of metals to polyimides." This invention focuses on a technique for laminating metals, particularly copper, to the surface of polyimides at temperatures significantly lower than the curing temperature of the imide polymers. The method involves surface modification of polyimides through thermal graft copolymerization and interfacial polymerization, allowing for concurrent lamination of the metal in the presence of suitable functional monomers. The resulting polyimide-metal interfaces demonstrate impressive T-peel adhesion strengths exceeding 16 N/cm, surpassing the fracture strength of polyimide films with a thickness of 75 µm.

Career Highlights

Arthur has made significant strides in his career, focusing on innovative methods that improve material properties and applications. His work has implications in various industries, particularly in electronics and aerospace, where the durability and performance of materials are critical.

Collaborations

Arthur Khoon Siah Ang has collaborated with notable colleagues, including En-Tang Kang and Koon Gee Neoh. These partnerships have contributed to the advancement of research and development in their respective fields.

Conclusion

Arthur Khoon Siah Ang's innovative approach to the lamination of metals to polyimides showcases his expertise and commitment to advancing material science. His contributions are valuable to various industries, highlighting the importance of innovation in technology.