Aofeng Qian

Title: Aofeng Qian: Innovator in Wiring Design Technology

Introduction

Aofeng Qian is a notable inventor based in Shanghai, China. He has made significant contributions to the field of wiring design, particularly in the context of flip chip technology. His innovative approach has led to the development of a unique wiring design method that enhances the functionality and efficiency of package substrates.

Latest Patents

Aofeng Qian holds a patent for a "Wiring design method, wiring structure, and flip chip." This patent outlines a comprehensive wiring design method that includes arranging bump pads in an array of rows and columns. The bump pads are specifically designed to bond with conductive bumps on a flip chip die. The design incorporates both signal pads and non-signal pads, with the non-signal pad featuring a via hole. Additionally, the method utilizes a layer of wiring to lead a subset of the signal pads out of the orthographic projection region of the flip chip die on the package substrate. This subset is configured to carry all functional signals required by the design specifications of the flip chip die.

Career Highlights

Aofeng Qian is currently employed at Nextvpu (Shanghai) Co., Ltd. His work at this company focuses on advancing wiring design technologies that are crucial for modern electronic devices. His expertise in this area has positioned him as a key player in the industry.

Collaborations

Aofeng has collaborated with notable colleagues such as Gang Qin and Xinpeng Feng. These collaborations have fostered an environment of innovation and creativity, contributing to the development of cutting-edge technologies in wiring design.

Conclusion

Aofeng Qian's contributions to wiring design technology exemplify the impact of innovative thinking in the electronics industry. His patent and work at Nextvpu highlight his commitment to advancing technology and improving the functionality of electronic devices.