Anil K Kollipara

Title: Anil K Kollipara: Innovator in Thermal Management Technologies

Introduction

Anil K Kollipara is a notable inventor based in Kokomo, Indiana, recognized for his contributions to thermal management technologies. He holds a patent that showcases his innovative approach to enhancing heat dissipation in electronic components. His work is particularly relevant in the field of semiconductor technology, where efficient thermal management is crucial for performance and reliability.

Latest Patents

Anil K Kollipara's most recent patent is titled "Ultra-thick thick films for thermal management and current carrying." This invention discloses an ultra-thick thick film made of copper, silver, or other suitable conductor materials. The film is designed to spread heat laterally along a substrate, effectively managing heat generated by components such as semiconductor chips. The ultra-thick films have a thickness ranging from about 2 to about 5 mils and are prepared from metal powders with average particle sizes between 1 micron and 3 microns. This innovation addresses the critical need for efficient heat dissipation in electronic devices.

Career Highlights

Anil K Kollipara is currently employed at Delco Electronics Corporation, where he applies his expertise in thermal management. His work at Delco has allowed him to contribute significantly to advancements in electronic component design and functionality. With a focus on practical applications of his inventions, he has made a lasting impact in the industry.

Collaborations

Throughout his career, Anil has collaborated with several talented individuals, including Bruce Alan Myers and Dwadasi H Sarma. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Anil K Kollipara's contributions to thermal management through his patented inventions highlight his role as a key innovator in the field. His work not only enhances the performance of electronic devices but also sets a foundation for future advancements in thermal management technologies.