Angela M Kneeland

Title: Angela M Kneeland: Innovator in Multichip Module Substrate Technology

Introduction

Angela M Kneeland is a prominent inventor based in Putnam, CT (US). She has made significant contributions to the field of electronics through her innovative work in multichip module substrates. Her expertise and dedication to advancing technology have led to the development of a unique manufacturing process that enhances the performance and reliability of electronic devices.

Latest Patents

Angela holds a patent for a "Method of manufacture multichip module substrate." This invention involves an additive process that utilizes multiple layers of a fluoropolymer composite material and copper. The process includes plating copper layers and laminating fluoropolymer composite layers. A seeding process is employed to ensure reliable bonding between the materials. This innovative approach eliminates the need for a barrier metal layer, allowing for a more efficient and effective substrate design. The multichip module substrate can accommodate multiple metal and dielectric layers, facilitating complex electronic structures.

Career Highlights

Angela M Kneeland has established herself as a key figure in her field, working at Rogers Corporation. Her work has not only contributed to the company's success but has also advanced the industry as a whole. With her patent, she has paved the way for improved thermal management and electrical interconnections in multichip modules.

Collaborations

Angela has collaborated with notable colleagues, including W David Smith and John A Olenick. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Angela M Kneeland's contributions to multichip module substrate technology exemplify her commitment to innovation in electronics. Her patent and work at Rogers Corporation highlight her role as a leading inventor in the industry.