Company Filing History:
Years Active: 2022-2025
Title: Innovations by Amirul Afiq Bin Hud
Introduction
Amirul Afiq Bin Hud is a notable inventor based in Melaka, Malaysia. He has made significant contributions to the field of integrated circuit packaging, holding a total of 4 patents. His work focuses on enhancing the efficiency and functionality of electronic components.
Latest Patents
One of Amirul's latest patents is titled "Lead frame rolling." This method involves rolling a roller with a protrusion across a lead frame to create an indent in a feature of the lead frame. It includes attaching a die to a die attach pad of the lead frame, coupling the die with a lead, and enclosing portions of the die, the die attach pad, and portions of the lead frame feature with a molding compound. The system comprises a roller with a cylindrical body and a protrusion, a chuck to engage a lead frame, and a controller to roll the roller across the lead frame to create an indent in a feature of the lead frame.
Another significant patent is "Solder surface features for integrated circuit packages." This patent describes an integrated circuit (IC) package that includes a semiconductor die comprising an IC and an IC package enclosure that substantially encloses the semiconductor die. The IC package also features at least one conductive metal contact, each coupled to the semiconductor die and comprising a planar solder surface exterior to the IC package enclosure. This design allows for efficient soldering to external conductive metal contacts.
Career Highlights
Amirul Afiq Bin Hud is currently employed at Texas Instruments Corporation, where he continues to innovate in the field of electronics. His work has contributed to advancements in integrated circuit technology, making significant impacts on the industry.
Collaborations
Amirul has collaborated with talented coworkers such as Adi Irwan Bin Herman and Wei Fen Sueann Lim. Their combined expertise has fostered a creative environment that encourages innovation and development.
Conclusion
Amirul Afiq Bin Hud is a prominent inventor whose work in integrated circuit packaging has led to multiple patents and advancements in technology. His contributions continue to shape the future of electronics.