Company Filing History:
Years Active: 1989-1995
Title: Allen M Jones: Innovator in Electronic Component Packaging
Introduction
Allen M Jones is a notable inventor based in Novi, MI (US), recognized for his contributions to the field of electronic component packaging. With a total of 5 patents to his name, he has made significant advancements that enhance the protection and functionality of electronic devices.
Latest Patents
Among his latest innovations is the "Shielded self-molding package for an electronic component." This invention features an electromagnetically shielded self-molding package that includes a pair of bags with an electrically conductive coating. These bags are designed to encase the electronic component, with a polymerizable resin filling the space between the bags and the component. Another notable patent is the "Self tooling, molded electronics packaging." This method involves protecting an electronic component from environmental factors by using a thermoplastic heat shrink material bag. The process includes inserting the component into the bag, injecting a liquid polymerizable resin, heating the bag to shrink it around the component, and curing the resin.
Career Highlights
Allen M Jones is currently employed at Williams International, where he applies his expertise in developing innovative packaging solutions for electronic components. His work has contributed to advancements in the reliability and performance of electronic devices.
Conclusion
Allen M Jones stands out as a key figure in the innovation of electronic component packaging, with a focus on enhancing protection and functionality through his patented inventions. His contributions continue to impact the industry positively.