Valparaiso, IN, United States of America

Alfred William Kehe


Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 28(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: Innovations of Alfred William Kehe

Introduction

Alfred William Kehe is an accomplished inventor based in Valparaiso, IN (US). He has made significant contributions to the field of thermoplastic elastomers and their applications in various industries. His innovative work focuses on enhancing the adhesion of these materials to metal substrates, which is crucial for many manufacturing processes.

Latest Patents

Kehe holds a patent for a composition and method that promotes the adhesion of thermoplastic elastomers to metal substrates. This patent describes a method that eliminates the need for special primers or additional resin additives. By incorporating a carboxyl-modified poly (alpha-olefin) polymer resin into an enamel coating composition, he has developed a solution that enhances adhesion. The preferred embodiment of this invention involves a corrosion-resistant cresol-formaldehyde/epoxy resin coating that contains a maleic anhydride-modified polypropylene resin adhesion promoter. This innovative approach is particularly useful for bonding shaped thermoplastic elastomer articles, such as SEBS, PBR, and EPDM copolymers, to metallic substrates. These bonded structures are especially beneficial for metal closures used in food containers that undergo high-temperature filling, sterilization, and retort processing conditions.

Career Highlights

Alfred William Kehe is associated with White Cap, Inc., where he continues to apply his expertise in materials science and engineering. His work has had a lasting impact on the industry, particularly in improving the performance and reliability of thermoplastic elastomer applications.

Conclusion

Alfred William Kehe's innovative contributions to the field of thermoplastic elastomers demonstrate his commitment to advancing technology in adhesion methods. His patent reflects a significant step forward in enhancing the durability and functionality of materials used in various applications.

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