Company Filing History:
Years Active: 1986-1998
Title: Alfred Schad: Innovator in Thermoformed Packaging
Introduction
Alfred Schad is a notable inventor based in Wiesbaden, Germany. He has made significant contributions to the field of packaging technology, particularly in thermoformed packages. With a total of 3 patents to his name, Schad has developed innovative solutions that enhance the functionality and usability of packaging materials.
Latest Patents
Among his latest patents, Schad has created a thermoformed package with integrated predetermined breaking points. This innovative design features discrete regions in the plastic matrix where the mechanical properties have been modified by the action of a laser beam. Additionally, he has developed a cup-like package with a peel-off cover film made of plastic. This package is designed for substantially flowable or pourable products and includes a one-piece receptacle that is sealed at the top filling and removal opening.
Career Highlights
Alfred Schad is currently associated with Hoechst Aktiengesellschaft, a leading company in the chemical and pharmaceutical industry. His work focuses on advancing packaging technologies that meet the evolving needs of consumers and industries alike.
Collaborations
Throughout his career, Schad has collaborated with talented individuals such as Ekkehard Beer and Tobias Rentzsch. These partnerships have contributed to the successful development of his innovative packaging solutions.
Conclusion
Alfred Schad's contributions to thermoformed packaging demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of material properties and consumer needs, positioning him as a key figure in packaging technology.